PANGOMICRO Logos PGL50H FPGA SoM Core Board Industrial Grade DDR3 P50

PGL50H

  • Model

    P50
  • Email

    David.ding@alinx.com
  • Temperature class

    -40℃~85℃
  • Ean

    6971390271810


China PANGOMICRO Logos FPGA SoM Core Board

High speed transceiver, 1GB DDR3, 128Mbit QSPI FLASH

High speed, high bandwidth, and high capacity are suitable for high-speed data communication, video image processing, high-speed data acquisition, and other applications

P50-紫光同创-核心板_03.jpg

Key Features

·Core board

P50详情-1.jpg
P50详情-2.jpg

Product Parameters


SoM Core Board Parameters

FPGA Chip

PGL50H-6IFBG484

Working Temperature

Industrial Grade -40℃~85℃

Flip-Flop (FF)

64200

LUT5

42800(LUT5=1.2LUT4)

DRM (18Kbits)

134

APM Unit (Multiplier)

84

PCIe Gen2x4

1

HSST

4 x 6.375Gb/s max

Clock resources PLL

5

AES

1


Interface and Function

DDR3

2 x 512MB DDR3, 32bit Bus, Data Rate 800Mbps

QSPI Flash

1 x 128Mbit , Used for FPGA Configuration File and User Data Storage

Crystal Oscillator

125 Mhz Provide Reference Input Clock for HSSTLP in FPGA
200 Mhz Provide Stable Clock Source for the System

IO

195 default level standards are 3.3V ordinary IO ports

Expansion Ports

4 x 80-Pin Panasonic Industrial Grade Connectors

LED

1 power indicator light, 1 configuration LED light, 1 user LED light


Power Supply Parameters

Voltage Input

+5V DC, Power Supply via Connector CON1


Package List

FPGA Core Board

1

 



Structure Size

Size Dimension

60mm x 60mm x 6mm



Number of Layers

14-Layer Core Board PCB


P50详情-3.jpg
P50详情-4.jpg

The warranty period of all products sold is 12 months, of which FPGA chips and LCD screens are wearing parts and are not covered by the warranty. All accessories and gifts are not covered under warranty.

Alinx Electronic Limited 沪ICP备13046728号