Xilinx Zynq UltraScale+ MPSoC SOM FPGA Core board AI XCZU19EG

XCZU19EG

  • Model

    ACU19EG
  • Email

    David.ding@alinx.com
  • Temperature class

    -40℃~85℃
  • Ean

    6971390279786
  • Price

    $ 3962


Xilinx Zynq UltraScale+ MPSoC FPGA High-end FPGA Board

Quad Core ARM Cortex™-A53,Dual Core ARM Cortex™-R5

Quad-core ARM Cortex-A53 combines dual-core Cortex-R5 real-time processor Mali-400 MP2 GPU and 16nm FinFET+ programmable logic to meet 5G wireless infrastructure, high-speed data exchange storage, industrial control, AI intelligence, cloud computing, 4K video transmission processing, and aerospace applications

  • ·ARM CPU

    4x ARM CORTEX-A53 + Dual Core ARM CORTEX-R5

  • ·GPU

    Mali™-400 MP2 GPU

  • ·9GB DDR4

    PS 5GB DDR4, PL 4GB DDR4

  • ·FLASH RAM

    32GB eMMC FLASH, 128MB QSPI FLASH

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key Features

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Corresponding Development Board

·Z19-P

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*Learn about the corresponding development board, Click to see details>>

Product Performance

Main Parameters

SoM Module

ACU19EG

FPGA Chip

XCZU19EG-2FFVC1760I

Chip CPU

4x ARM Cortex™-A53, 1.333GHz, Cortex™-R5 x2, 533MHz

GPU

Mali™-400 MP2

RAM

PS DDR4 5GB, 72bit, 2400Mbps, Support ECC
PL DDR4 4GB, 64bit, 2400Mbps

PS side High-Speed Connection

PCIe Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort, 4x Tri-mode Gigabit Ethernet

PS side General Connection

2x USB 2.0, 2 x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO

Chip Level

Industrial grade, -40°c~85°c

Logic Cells

1,143K

Flip-Flops

1,045K

LUTs

523K

Distributed RAM

9.8Mb

Block RAM

34.6Mb

UltraRAM

36.0Mb

CMTs

11

DSP Slices

1,968


Interface and Function

150G Interlaken

4

100G Ethernet

4

PL PCIE Gen 3

PCIE Gen3 x5

PL GTH

12.5Gb/s x32

PL GTY

28.21Gb/s x16

PL HP I/O

240

PL HD I/O

96

eMMC FLASH

32GB

QSPI FLASH

128MB

Expansion port

8-way 120-pin 0.5mm spacing extension connector with Panasonic high-speed industrial grade board-to-board connector

Crystal oscillator

A RTC real-time clock provides 32.768 KHz , real-time clock source for PS system
A single-ended 33.333MHz, crystal vibration is supplied to the PS system clock input
A Differential 200MHz crystal oscillation supplied to PL logic, DDR4 reference clock


Power Supply Parameters

Voltage Input

Board to Board Connector, +12V DC


Package List

FPGA SoM Board

1

 



Structure Size

Size Dimension

80 x 80 x 11.8 mm

Connector Height

3.0mm

Number of Layers

16-Layer Core Board PCB

 



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XILINX VITIS-AI DPU

AI recognition detection, depth computing learning


Intelligent identification and detection, image and video processing, security monitoring, machine vision, fire monitoring,  traffic safety, smart construction site, smart hotel, smart agriculture, Internet of Things

Vehicle Identification

Infrared Vehicle Identification

AI-识别检测2-淘宝京东_11.jpg

Pedestrian recognition

Indoor Person Recognition

Fire detection

Helmet detection

Concrete defect detection

PCB defect detection


Super Combination with Mali™-400 MP2 GPU, 64bit DDR4 RAM

Industiral Grade Chip Dual ARM Application Processor

4x ARM Cortex-A53, 1.333GHz; Dual Cortex™-R5, 533MHz; PS 5GB DDR4, 72bit, Data rate 2400Mbps; PL 4GB DDR4, 64bit, Data rate 2400Mbps

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Get Started Quickly, Shorten Learning and Development Time

Provide Documents to Study

Provide Schematic, PCB, Size Dimension, Package and Reference Design, that to Accelerate the Development of products with Core Board

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The warranty period of all products sold is 12 months, of which FPGA chips and LCD screens are wearing parts and are not covered by the warranty. All accessories and gifts are not covered under warranty.

Alinx Electronic Limited 沪ICP备13046728号