Xilinx Kintex UltraScale+ FPGA Board SOM PCIE3.0 GTY XCKU15P ACKU15

PCIe 3.0 x16, GTY 28Gb/s x24 transceiver, GTH 16Gb/s x32 transceiver

The core board uses 16nm process Kinex UltraScale+ devices, which significantly reduces power consumption by 60% compared to the 7-series FPGA; The GTY 28Gb/s x24, GTH 16Gb/s x32 transceivers, and 100G Ethernet provide cost-effective solutions for applications that require high-end functionality. It is an ideal choice for applications such as wireless MIMO technology, PON access, Nx100G wired network, data center network and storage acceleration, video image processing, semiconductors, industrial control, machine vision, Internet of Things, and medical imaging

key Features

·Corresponding Development Board

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Product parameters

packing list

SOM

1

结构尺寸

Size

80x80mm

Number of layers

Core board with 17 layers of PCB design

Dimensional Drawing of Core Board Structure

Shorten Learning and Development Time

Provide Schematic, PCB, Size Dimension, Package and Reference Design, that to Accelerate the Development of products with Core Board

Network communication

Data center network and storage acceleration

Medical Imaging

automation

Video Imaging

Internet of Things

Semiconductor ATE

machine vision